Thermal Adhesives

Thermal adhesives are a type of adhesive commonly used to attach a heatsink to electronic components. The glue is typically a two part epoxy resin which cures to form a strong bond. They are thermally conductive and usually electrically insulating, helping to dissipate heat from the device to prevent overheating or a breakdown.


The main function of a thermal adhesive is to ensure there is no air space between which would act as a thermal insulator. It fills in the microscopic imperfections on the heatsink and device.


There are a variety of thermal compound adhesives available that are ideal for eliminating the air gap under a heat sink. The most common types of thermally conductive adhesives are:



  • Thermal paste

  • Thermal glue

  • Thermal adhesive tape

  • Thermal Grease

  • Thermal Gap Pads


Applications


Thermal adhesives are used in a variety of industries and applications such as:



  • Heat sink bonding

  • Potting/encapsulating sensors

  • BGA die heat spreader interface

  • Chip scale packages

  • Power semiconductors


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Description Price Trade Name Type Product Material Package Type Package Size Thermal Conductivity Cure Time Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour Operating Temperature Range Physical Form
RS庫存編號 155-8320
製造零件編號TBS20S
HK$174.70
單位
- Thermal Conductive Compound Epoxy Syringe 20 ml 1.1W/mK 48 h +120°C -40°C - - - -40 → +120 °C -
RS庫存編號 725-9971
製造零件編號TCER75S
HK$382.58
單位
- Thermal Conductive Adhesive Ethoxy Syringe 75 ml 1.8W/mK 24 h +230°C -50°C - - - -50 → +230 °C -
RS庫存編號 725-9975
製造零件編號TCOR75S
HK$302.38
單位
- Thermal Conductive Adhesive Metal Oxide Syringe 75 ml 1.8W/mK 24 h +230°C -50°C - - - -50 → +230 °C -
RS庫存編號 165-5582
製造零件編號TPM35001K
HK$1,496.64
單位
- Thermally Conductive Phase Change Material - Container 1 kg 3.5W/mK - +125°C -40°C - - - -40 → +125 °C -