Thermal Adhesives

Thermal adhesives are commonly used to attach a heatsink to electronic components. The glue is typically a two part epoxy resin which cures to form a strong bond. They are thermally conductive and usually electrically insulating and help to dissipate heat from the device.
Its main function is to ensure there is no air space between which would act as a thermal insulator. It fills in the microscopic imperfections on the heatsink and device.
There are other types of products to eliminate the air gap under a heat sink:
• Thermal Grease
• Thermal Gap Pads

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Description Price Trade Name Type Product Material Package Type Package Size Thermal Conductivity Cure Time Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour Operating Temperature Range Special Features
RS庫存編號 155-8320
製造零件編號TBS20S
HK$145.67
單位
- Thermal Conductive Compound Epoxy Syringe 20 ml 1.1W/mK 48 h +120°C -40°C - - - -40 → +120 °C -
RS庫存編號 165-5582
製造零件編號TPM35001K
HK$1,499.93
單位
- Thermally Conductive Phase Change Material - Container 1 kg 3.5W/mK - +125°C -40°C - - - -40 → +125 °C -
RS庫存編號 725-9971
製造零件編號TCER75S
HK$364.95
單位
- Thermal Conductive Adhesive Ethoxy Syringe 75 ml 1.8W/mK 24 h +230°C -50°C - - - -50 → +230 °C -
RS庫存編號 725-9975
製造零件編號TCOR75S
HK$355.13
單位
- Thermal Conductive Adhesive Metal Oxide Syringe 75 ml 1.8W/mK 24 h +230°C -50°C - - - -50 → +230 °C -