50Ω STMicroelectronics Surface Mount Chip Balun

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Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance

2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²

規格
Attribute Value
Unbalance Impedance 50
Balance Impedance 50Ω
Maximum Insertion Loss 1.3dB
Mounting Type Surface Mount
Pin Count 6
Dimensions 2.1 x 1.35 x 0.455mm
Height 0.455mm
Length 2.1mm
Width 1.35mm
Maximum Frequency 2.5
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
5000 現貨庫存,可於3工作日發貨。
單價 個 (在毎卷:5000)
HK$ 1.21
(不含稅)
單位
Per unit
Per Reel*
5000 +
HK$1.21
HK$6,050.00
* 參考價格