50Ω STMicroelectronics Surface Mount Chip Balun

產品概覽和技術數據資料表
法例與合規
相容
產品詳細資訊

Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

STMicroelectronics' BALF-CC26-05D3 is an ultra-miniature balun, integrating both matching network and harmonics filter. Matching impedance has been customized for the TI CC26xx series 5x5 SimpleLink™ multistandard wireless MCU. The device uses STMicroelectronics' IPD technology on a non-conductive glass substrate, which optimizes RF performance

2.45 GHz balun with integrated matching network
Matching optimized for CC26 series 5´5 external differential
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated Flip-Chip on glass
Small footprint < 1.5 mm²

規格
Attribute Value
Unbalance Impedance 50Ω
Balance Impedance 50Ω
Maximum Insertion Loss 1.5dB
Mounting Type Surface Mount
Pin Count 5
Length 1.485mm
Maximum Frequency 2.5
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
5000 現貨庫存,可於3工作日發貨。
單價 /個 (每包:50個)
HK$ 2.20
(不含稅)
單位
Per unit
Per Pack*
50 - 50
HK$2.20
HK$110.00
100 - 450
HK$1.64
HK$82.00
500 - 950
HK$1.26
HK$63.00
1000 +
HK$1.16
HK$58.00
* 參考價格
包裝方式: