Heatsink Adhesive Tape for use with Heatsink

  • RS庫存編號 477-4856
  • 製造零件編號 BP100-0.005-00-00-12
  • 製造商 Bergquist
產品概覽和技術數據資料表
法例與合規
相容
COO (Country of Origin): US
產品詳細資訊

Bond-Ply 100

Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.

Uses include:

Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor

Note

Stock Number 477-4856 dimensions 150 x 150 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm

規格
Attribute Value
Accessory Type Adhesive Tape
For Use With Heatsink
133 現貨庫存,可於3工作日發貨。
單價 個
HK$ 142.54
(不含稅)
單位
Per unit
1 - 24
HK$142.54
25 - 99
HK$126.73
100 - 249
HK$125.82
250 - 499
HK$124.89
500 +
HK$123.98