Amphenol FCI 400 SMT Prototyping Socket, BGA

  • RS庫存編號 182-2279
  • 製造零件編號 74221-101LF
  • 製造商 Amphenol FCI
產品概覽和技術數據資料表
法例與合規
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COO (Country of Origin): US
產品詳細資訊

High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

規格
Attribute Value
Gender Female
Number of Contacts 400
Package Type BGA
Socket Mounting Type Surface Mount
Contact Material Copper Alloy
Contact Plating Gold
Current Rating 450mA
Device Mounting Type Surface Mount
Housing Material Liquid Crystal Polymer
Termination Method Through Hole
Voltage Rating 200 V ac
250 現貨庫存,可於3工作日發貨。
單價 個 (在毎卷:250)
HK$ 238.663
(不含稅)
單位
Per unit
Per Reel*
250 +
HK$238.663
HK$59,665.75
* 參考價格