SOCKET P HARDWARE DUST COVER

產品概覽和技術數據資料表
法例與合規
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產品詳細資訊

TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling. As one of a limited number of suppliers of this technology, TE is your dependable socket partner to support current and future Intel CPU processor designs.

Two-piece design for increased reliability: First LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability
Dependable partner: As new generations of chip platforms are developed, TE will offer the latest LGA sockets for your designs
APPLICATIONS
Servers
Data Centers
High Performance Computing (HPC)

規格
Attribute Value
Package Type LGA
Housing Material ABS, Polycarbonate
84 現貨庫存,可於3工作日發貨。
單價 Each (In a Tray of 12)
HK$ 35.125
(不含稅)
單位
Per unit
Per Tray*
12 - 48
HK$35.125
HK$421.50
60 +
HK$32.929
HK$395.148
* 參考價格