Elektro Bauelemente Gmbh, 12 Position SP12T Rotary Switch, 200 mA @ 115 V, Through Hole

Wafer switch with gold break-before-make contacts
The switch mechanism is provided with a 4mm central spindle which can be loaded with up to five wafers
The mechanism may be panel mounted (anti-rotational lug fitted) to a max. panel thickness of 3mm, or secured to a PCB by two M2 screws (not supplied)
The indexing is by 30° steps with two integral stop pins which can be set by removing the back nut and ring and moving them to the required positions
Wafers, supplied separately, are available in 1-pole 12-way and 2-pole 6-way versions
Spacing between adjacent pins is 0.1in whilst spacing between rows of pins is on a 0.15in pitch matrix
Either row of wafer switch contacts may be wired as a common pole
Wafers are supported by pre-cut tapped spacers (secured at each tapped end by screws, supplied) which set the correct depth behind the panel for the number of wafers required
The switch wafer operating shaft to be cut to length
Suitable for low level and dry circuit switching