Winbond, W971GG8SB25I

  • RS庫存編號 188-2582
  • 製造零件編號 W971GG8SB25I
  • 製造商 Winbond
產品概覽和技術數據資料表
法例與合規
相容
產品詳細資訊

Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V
Double Data Rate architecture: two data transfers per clock cycle
CAS Latency: 3, 4, 5, 6 and 7
Burst Length: 4 and 8
Bi-directional, differential data strobes (DQS and DQS) are transmitted / received with data
Edge-aligned with Read data and center-aligned with Write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CLK and CLK)
Data masks (DM) for write data
Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
Posted CAS programmable additive latency supported to make command and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
Auto-precharge operation for read and write bursts
Auto Refresh and Self Refresh modes
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = Read Latency - 1 (WL = RL - 1)
Interface: SSTL_18
Packaged in WBGA 60 Ball (8x12.5 mm2), using Lead free materials.

規格
Attribute Value
Memory Size 1Gbit
Organisation 128M x 8 bit
Number of Bits per Word 8bit
Number of Words 128M
Mounting Type Surface Mount
Package Type WBGA
Pin Count 60
Dimensions 12.6 x 8.1 x 0.6mm
Height 0.6mm
Length 12.6mm
Minimum Operating Temperature -40 °C
Minimum Operating Supply Voltage 1.7 V
Width 8.1mm
Maximum Operating Temperature +95 °C
Maximum Operating Supply Voltage 1.9 V
209 現貨庫存,可於3工作日發貨。
單價 Each (In a Tray of 209)
HK$ 26.496
(不含稅)
單位
Per unit
Per Tray*
209 - 209
HK$26.496
HK$5,537.664
418 - 418
HK$26.378
HK$5,513.002
627 - 836
HK$25.313
HK$5,290.417
1045 - 4807
HK$24.13
HK$5,043.17
5016 +
HK$21.765
HK$4,548.885
* 參考價格