Bergquist Heatsink Adhesive Tape for use with Heatsink
- RS庫存編號:
- 477-4840
- 製造零件編號:
- BP100-0.005-00-1112
- 製造商:
- Bergquist
- RS庫存編號:
- 477-4840
- 製造零件編號:
- BP100-0.005-00-1112
- 製造商:
- Bergquist
法例與合規
- COO (Country of Origin):
- US
產品詳細資訊
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Note
Stock Number 477-4856 dimensions 150 x 150 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
規格
Attribute | Value |
|---|---|
| Accessory Type | Adhesive Tape |
| For Use With | Heatsink |