Potting Compounds

Potting compounds are a general-purpose type of sealant that can offer environmental, mechanical and physical protection to circuit boards and electronic assemblies. Used in electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which provides protection from moisture, vibration, thermal or physical shock and general contamination. The mechanical protection enables the components to maintain high performance under extreme conditions. Thermosetting plastics or silicone rubber gels are often used.

Types of compounds:

Epoxy Potting Compounds - Epoxy potting compounds generally have better adhesion, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predicable. They have good high temperature resistance up to 400°F

Urethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are a good selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the properties

Silicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures.

Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials. They benefit from very fast hardening, adequate chemical resistance and are clear in appearance


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Description Price Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS庫存編號 164-321
製造零件編號ER1450RP250G
HK$197.24
單位
- Epoxy Pack 250 g Water Resistance 2 h 70 Shore A - White +150°C -50°C - - -
RS庫存編號 164-292
製造零件編號UR5044RP250G
HK$173.73
單位
- PUR Pack 250 g Reenterable 24 h 40 Shore A, 60 Shore A, 80 Shore A 0.25W/mK Blue +120°C -70°C - - -
RS庫存編號 725-9997
製造零件編號ER2218RP250G
HK$168.17
單位
- Epoxy Pack 250 g Flame Retardant 24 h 55 Shore D, 90 Shore A 0.28W/mK Black +150°C -50°C - - -
RS庫存編號 458-800
製造零件編號UR5083RP250G
HK$273.22
單位
- PUR Pack 250 g Water Resistance 48 → 72 h - - Translucent +100°C -60°C - - -
RS庫存編號 164-315
製造零件編號ER2195RP250G
HK$141.61
單位
- Epoxy Pack 250 g Flame Retardant 36 h 80 Shore D 0.45W/mK Black +130°C -40°C - - -
RS庫存編號 166-844
製造零件編號UR5097RP250G
HK$178.32
單位
- PUR Pack 250 g Encapsulating Compound, Flame Retardant, Thermal Conductivity 24 h 85 Shore A 0.65W/mK Black +110°C -40°C - - -
RS庫存編號 164-337
製造零件編號ER1448RP250G
HK$169.20
單位
- Epoxy Pack 250 g Water Resistance 12 h 70 Shore A - Black +150°C -50°C - - -