MG Chemicals Cold Solder Solid Adhesive, 21 g

The MG Chemicals 21g silver conductive epoxy is a slow cure electronic grade adhesive that bonds to many substrates that are used in electronics assemblies. The adhesive resists thermal and mechanical shocks and has been designed for production environments when high cure temperatures can damage your heat-sensitive components. It has 0.0007ohm-cm electrical resistivity and 1.75W/(m·K) thermal conductivity.

Cure time of 120 minutes
Optimal cure temperature of only 65°C
Easy 1:1 mix ratio
Versatile
High viscosity
Cure time of 60 minutes
No freezing or dry ice required when shipping or storing
Long shelf life
Excellent water and chemical resistance
Effective for gap filling between metal plates
Excellent adhesion to most electronic substrates
Strong water and chemical resistance

Use for repair and assembly in optoelectronics and microelectronics
Aerospace
Marine communication
Industrial control equipment industries

RoHS certified
REACH compliant
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007