- RS庫存編號:
- 163-9747P
- 製造零件編號:
- BALF-ATM-01E3
- 製造商:
- STMicroelectronics
此產品已停售
- RS庫存編號:
- 163-9747P
- 製造零件編號:
- BALF-ATM-01E3
- 製造商:
- STMicroelectronics
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
Baluns use STs process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics IPD technology on a non-conductive glass substrate to optimize RF performance
2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²