Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
- RS庫存編號:
- 200-5494
- 製造零件編號:
- 35310100 BOP 10.1 S
- 製造商:
- Bopla
- RS庫存編號:
- 200-5494
- 製造零件編號:
- 35310100 BOP 10.1 S
- 製造商:
- Bopla
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.
IP65 rating
UL 94 V0 Fire class
Design seal optional
UL 94 V0 Fire class
Design seal optional
規格
Attribute | Value |
|---|---|
| Type | Seal |
| Length | 291mm |
| For Use With | BoPad 10.1 Enclosures |
| Width | 204mm |
| Dimensions | 291 x 204 x 54.3mm |
| Height | 54mm |
| Series | BoLink |