Infineon NOR 256Mbit SPI Flash Memory 16-Pin SO, S25FL256SAGMFV001

CMOS 3.0 Volt Core with Versatile I/O
SPI with Multi-I/O
SPI Clock polarity and phase modes 0 and 3
DDR option
Extended Addressing: 24- or 32-bit address options
Serial Command set and footprint compatible with
S25FL-A, S25FL-K, and S25FL-P SPI families
Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
AutoBoot - power up or reset and execute a Normal or Quad read command automatically at a preselected address
Common Flash Interface (CFI) data for configuration information.
Programming (1.5 MBps)
256 or 512 Byte Page Programming buffer options
Quad-Input Page Programming (QPP) for slow clock systems
Automatic ECC-internal hardware Error Correction Code generation with single bit error correction
Erase (0.5 to 0.65 MBps)
Hybrid sector size option - physical set of thirty two 4-KB sectors at top or bottom of address space with all remaining sectors of 64 KB, for compatibility with prior generation S25-FL devices
Uniform sector option - always erase 256-KB blocks for soft-ware compatibility with higher density and future devices.
Cycling Endurance
100,000 Program-Erase Cycles, minimum Data Retention
20 Year Data Retention, minimum
Security features
OTP array of 1024 bytes
Block Protection:
Status Register bits to control protection against program or erase of a contiguous range of sectors.
Hardware and software control options
Advanced Sector Protection (ASP)
Individual sector protection controlled by boot code or password
Cypress® 65 nm MirrorBit
® Technology with Eclipse™ Architecture
Core Supply Voltage: 2.7V to 3.6V
I/O Supply Voltage: 1.65V to 3.6V
SO16 and FBGA packages
Temperature Range / Grade:
Industrial (40°C to +85°C)
Industrial Plus (40°C to +105°C)
Packages (all Pb-free)
16-lead SOIC (300 mil)
WSON 6  8 mm
BGA-24 6  8 mm
•5  5 ball and 4  6 ball footprint options
Known Good Die (KGD) and Known Tested Die

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