Heatsink, BGA, 10.8K/W, 26 x 26 x 12mm, Wire Clip

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COO (Country of Origin): CN
產品詳細資訊

CCI Chipset Heatsink

Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.

Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection

Manufacturer Part No Intel Part No Dimensions (mm) Centre Space (mm) Clip Stock no.
00C855902B C45198-001 60x53x35 20x20 No 492-137
00C863501A C85366-001 80x59x36 15x15 No 492-131
00C855802B C46655-001 31x31x12 26x26 Wire 492-165
00C87201A D12403-001 42x42x29 20x20 Wire 492-171
MR16-4823 - 49x49x22 LED No 492-153

BGA Heatsinks

規格
Attribute Value
For Use With BGA
Length 26mm
Width 26mm
Height 12mm
Dimensions 26 x 26 x 12mm
Thermal Resistance 10.8K/W
Mounting Wire Clip
Material Aluminium
97 現貨庫存,可於3工作日發貨。
單價 個
HK$ 14.88
(不含稅)
單位
Per unit
1 - 9
HK$14.88
10 - 24
HK$14.10
25 - 49
HK$12.89
50 - 99
HK$12.18
100 +
HK$11.62