Heatsink, BGA, 10.8K/W, 26 x 26 x 12mm, Wire Clip

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COO (Country of Origin): CN
產品詳細資訊

CCI Chipset Heatsink

Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.

Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection

BGA Heatsinks

規格
Attribute Value
For Use With Universal Square Alu
Length 26mm
Width 26mm
Height 12mm
Dimensions 26 x 26 x 12mm
Thermal Resistance 10.8K/W
Mounting Wire Clip
Package Type BGA
Material Aluminium
79 現貨庫存,可於3工作日發貨。
單價 個
HK$ 20.02
(不含稅)
單位
Per unit
1 - 9
HK$20.02
10 - 24
HK$18.97
25 - 49
HK$17.34
50 - 99
HK$16.39
100 +
HK$15.63