OIS-330-740-X-TU EPIGAP OSA Photonics, OIS-330 740nm IR LED, 1206 SMD package
- RS庫存編號:
- 173-6320P
- 製造零件編號:
- OIS-330-740-X-TU
- 製造商:
- EPIGAP OSA Photonics
可享批量折扣
小計 130 件 (按連續帶提供)*
HK$1,553.50
訂單超過 HK$250.00 免費送貨
有限的庫存
- 加上 230 件從 2025年12月16日 起發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 130 - 640 | HK$11.95 |
| 650 + | HK$9.83 |
* 參考價格
- RS庫存編號:
- 173-6320P
- 製造零件編號:
- OIS-330-740-X-TU
- 製造商:
- EPIGAP OSA Photonics
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | EPIGAP OSA Photonics | |
| Peak Wavelength | 740nm | |
| Package Type | 1206 | |
| Radiant Intensity | 8mW/sr | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 3.2 x 1.6 x 1.2mm | |
| Lens Shape | Dome | |
| Series | OIS-330 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Maximum Supply Voltage | 2V | |
| 選取全部 | ||
|---|---|---|
品牌 EPIGAP OSA Photonics | ||
Peak Wavelength 740nm | ||
Package Type 1206 | ||
Radiant Intensity 8mW/sr | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 3.2 x 1.6 x 1.2mm | ||
Lens Shape Dome | ||
Series OIS-330 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
Maximum Supply Voltage 2V | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
with lens, mounting from backside of PCB
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
