The Nexperia dual, standard level N-channel MOSFET in an LFPAK56D package (half-bridge configuration), using Trench 9 Trench MOS technology. This product has been designed and qualified to AEC-Q101.
LFPAK56D package with half-bridge configuration enables Reduced PCB layout complexity PCB shrinkage through reduced component footprint for 3-phase motor drive Improved system level Rth(j-amb) due to optimized package design Lower parasitic inductance to support higher efficiency Footprint compatibility with LFPAK56D Dual package Advanced AEC-Q101 grade Trench 9 silicon technology Low power losses, high power density Superior avalanche performance Repetitive avalanche rated
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