InvenSense 6 Axis Surface Accelerometer & Gyroscope 1.7 V 3.6V, I2C/SPI, LGA, 14-Pin
- RS庫存編號:
- 218-2216P
- 製造零件編號:
- ICM-42605
- 製造商:
- InvenSense
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可享批量折扣
小計 100 件 (按連續帶提供)*
HK$3,055.00
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單位 | 每單位 |
|---|---|
| 100 - 498 | HK$30.55 |
| 500 - 998 | HK$29.75 |
| 1000 + | HK$29.05 |
* 參考價格
- RS庫存編號:
- 218-2216P
- 製造零件編號:
- ICM-42605
- 製造商:
- InvenSense
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | InvenSense | |
| Sensor Type | Motion Sensor Module | |
| Product Type | Accelerometer & Gyroscope | |
| Number of Axis | 6 | |
| Technology | Digital | |
| Mount Type | Surface | |
| Interface Type | I2C/SPI | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 3.6V | |
| Package Type | LGA | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Pin Count | 14 | |
| Height | 0.97mm | |
| Standards/Approvals | No | |
| Series | ICM-42605 | |
| Length | 0.3mm | |
| Automotive Standard | No | |
| Supply Current | 0.52mA | |
| 選取全部 | ||
|---|---|---|
品牌 InvenSense | ||
Sensor Type Motion Sensor Module | ||
Product Type Accelerometer & Gyroscope | ||
Number of Axis 6 | ||
Technology Digital | ||
Mount Type Surface | ||
Interface Type I2C/SPI | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 3.6V | ||
Package Type LGA | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Pin Count 14 | ||
Height 0.97mm | ||
Standards/Approvals No | ||
Series ICM-42605 | ||
Length 0.3mm | ||
Automotive Standard No | ||
Supply Current 0.52mA | ||
- COO (Country of Origin):
- TW
The InvenSense ICM series is a 6-axis motion tracking device for automotive applications that combines a 3-axis gyroscope and a 3-axis accelerometer. The gyroscope supports eight programmable full-scale range settings from ±15.625dps to ±2000dps, and the accelerometer supports four programmable full-scale range settings from ±2g to ±16g. It also features a 2 KB FIFO that can lower the traffic on the serial bus interface.
On-chip 16-bit ADCs and programmable filters
Digital-output temperature sensor
MEMS structure hermetically sealed and bonded at wafer level