Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Features and Benefits
• High current carrying capacity in a small footprint • High temperature housings for IR reflow soldering • Positive latching for secure mating connection • Fully isolated dual beam terminals for reliable electrical performance and contact • Solder tabs for secure connection to PCB • Glow Wire Compliant
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following: Military COTS (Commercial Off The Shelf) Solar power Consumer products (dryers, freezers, fridges, washing machines) Data communications (routers, servers) Medical Telecommunications Gaming terminals
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