Solder Paste in jar 250g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F.
Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads RoHS II and REACH compliant
