Weller Wire, 800 μm Solder Wire, 227 °C Melting Point
- RS庫存編號:
- 244-1545
- Distrelec 貨號:
- 301-15-226
- 製造零件編號:
- T0051401399
- 製造商:
- Weller
小計（1 件）*
HK$199.50
訂單超過 HK$250.00 免費送貨
有庫存
- 188 件準備從其他地點送貨
- 加上 90 件從 2026年12月03日 起發貨
- 加上 150 件從 2027年1月07日 起發貨
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單位 | 每單位 |
|---|---|
| 1 + | HK$199.50 |
* 參考價格
- RS庫存編號:
- 244-1545
- Distrelec 貨號:
- 301-15-226
- 製造零件編號:
- T0051401399
- 製造商:
- Weller
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Weller | |
| Product Type | Solder Wire | |
| Wire Diameter | 800μm | |
| Percent Lead | 0% | |
| Product Form | Wire | |
| Melting Point | 227°C | |
| Percent Silver | 0% | |
| Percent Tin | 0.6% | |
| Flux Type | M1 | |
| Product Weight | 100g | |
| Percent Copper | 0.05% | |
| Standards/Approvals | UPC | |
| Contents | Silver | |
| 選取全部 | ||
|---|---|---|
品牌 Weller | ||
Product Type Solder Wire | ||
Wire Diameter 800μm | ||
Percent Lead 0% | ||
Product Form Wire | ||
Melting Point 227°C | ||
Percent Silver 0% | ||
Percent Tin 0.6% | ||
Flux Type M1 | ||
Product Weight 100g | ||
Percent Copper 0.05% | ||
Standards/Approvals UPC | ||
Contents Silver | ||
- COO (Country of Origin):
- JP
Weller Solder Wire, 0.8mm Wire Diameter, 100g Product Weight - T0051401399
This solder wire provides a flux-cored alloy designed for precision joining in electronic assembly and repair contexts. It is intended for low-temperature fusion tasks where a controlled melting point and a compact spool size facilitate repeatable soldering operations with reduced thermal stress on components.
Features and Benefits:
• Flux type M1 reduces oxide formation during soldering
• Wire diameter 0.8mm supports fine to general-purpose work
• Melting point 227°C enables lower-temperature solder cycles
• Product weight 100g offers manageable spool handling
• Percent copper 0.05% improves joint wettability
• Percent tin 0.6% modifies alloy flow characteristics
• Wire diameter 0.8mm supports fine to general-purpose work
• Melting point 227°C enables lower-temperature solder cycles
• Product weight 100g offers manageable spool handling
• Percent copper 0.05% improves joint wettability
• Percent tin 0.6% modifies alloy flow characteristics
Applications
• Suitable for small-scale electronics assembly work
• Ideal for precision repair of consumer devices
• Used with temperature-controlled irons for delicate components
• Can be used for rework tasks on mixed-metal joints
• Appropriate for laboratory prototyping and test rigs
• Ideal for precision repair of consumer devices
• Used with temperature-controlled irons for delicate components
• Can be used for rework tasks on mixed-metal joints
• Appropriate for laboratory prototyping and test rigs
Is the solder suitable for lead-free requirements?
Yes, it contains 0% lead and is formulated for lead-free processes.
How does the alloy composition affect solder flow?
The low tin proportion combined with trace copper produces a measured flow that aids controlled fillet formation and limits excess spread.
What certification indicates manufacturing standards?
It carries UPC approval confirming conformity with specified production criteria.
How should it be handled to maintain flux performance?
Store the reel dry and at a stable room temperature to preserve the integrity of the flux core.