2010 Format CRCW Series - 1% (Paper T/R) (10Ω to 100kΩ)
Metal glaze on high quality ceramic Protective over glaze Excellent stability (ΔR/R ≤ 1 % for 1000h at 70 °C) Lead (Pb)-free solder contacts on Ni barrier layer Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
