Spring-loaded terminal for fast multipoint testing of PCB sub-assemblies during development and production. Designed to be pressed or epoxy bonded into pre-planned test beds, aligned with the track and pins of the board to be tested. Stock No. 521-601 has a gold-plated brass concave probe for locating PCB pins and solder joints. Stock No. 521-611 has a nickel plated carbon-steel pointed probe for making contact to flat track and pads. Probe is housed in a gold-plated brass body with a gold plated spring steel spring. Solder posts connection to terminals Recommended test-bed thickness: 5mm min. (epoxy bonded) 12mm max., (press fit) 15 mm max.
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