Use this RS PRO aluminium oxide thermal paste in conjunction with semiconductor devices and heat sinks. It offers a wide operating temperature range and excellent stability at high temperatures. This heat sink compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required, or between any surface where thermal conductivity or heat dissipation is important.
Features and Benefits
Enhanced performance
Manually applied
Quick drying
Reworkable around PCM temperature
Specifically designed for easy use and storage
Maintains superior contact with components
Properties
Active chemical components Aluminium oxide
Colour White
Thermal conductivity W/m.K (ASTM D5470) 3.5
Dielectric breakdown kV/mm: >10
Dielectric constant 8
Phase change temperature °C: 52
Storage temperature °C Standard room temp.
Viscosity cps 60000
Applications
High performance computer processors
Graphics
Power conversion equipment, power semiconductors - MOSFET, IGBT and RF Audio/video components