STMicroelectronics B-L462E-CELL1 Discovery kit for IoT node multi-channel communication with STM32L4 STM32L4,

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RS庫存編號:
218-4814
Distrelec 貨號:
302-93-546
製造零件編號:
B-L462E-CELL1
製造商:
STMicroelectronics
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品牌

STMicroelectronics

Kit Classification

Development Board

Product Type

Communication & Wireless Development Tool

RF Technology

Bluetooth, WiFi

Technology

ARM Cortex M4

For Use With

LBAD0ZZ1SE

Featured Device

STM32L4, SPSGRF-868, LIS3MDL, LPS22HB, MP34DT01, ISM43362-M3G-L44, VL53L0X, LSM6DSL, HTS221

Kit Name

B-L462E-CELL1 Discovery kit for IoT node multi-channel communication with STM32L4

Maximum Frequency

915MHz

Interface Type

Bluetooth, WiFi

Standards/Approvals

IEC 60825-1:2014

Cellular IoT Discovery kit powered by STM32L4 and ST4SIM


STMicroelectronics B-L462E-CELL1 Discovery kit is a turnkey development platform for cellular IoT devices. The Discovery kit contains a low-power Discovery main board powered by an LBAD0ZZ1SE module, a global coverage antenna, and a fan-out board. The LBAD0ZZ1SE module includes an STM32L462REY6TR microcontroller, an LBAD0XX1SC-DM ultra-small LTE Cat M/NB modem, and an ST4SIM-200M GSMA-certified embedded SIM with a prepaid cellular connectivity data plane. ST4SIM-200M can also be used as an embedded secure element (eSE) for application.

STMod+ and extended pins connectivity provide unlimited expansion capabilities with a large choice of specialized add-on boards. Moreover, the fan-out board supports add-on boards using mikroBUS, ESP‑01, Grove I²C, Grove UART, and breadboard. The B-L462E-CELL1 Discovery kit includes an ST-LINK debugger/programmer and comes with the comprehensive STM32Cube software libraries together with packaged software examples to demonstrate end-to-end connectivity.

LBAD0ZZ1SE module from Murata powered by STM32L462RE with built-in eSIM (ST4SIM-200M), LTE Cat M/NBIoT modem (LBAD0XX1SC-DM), and 1 Mbyte of Quad-SPI Flash memory

Ultra-low-power STM32L4 Series STM32L462REY6TR microcontroller based on the Arm® Cortex®-M4 core with 512 Kbytes of Flash memory and 160 Kbytes of RAM in a WLCSP64 package

64 Mbytes of onboard Quad-SPI Flash memory from Micron®, exclusive with the 1 MByte of Quad-SPI Flash memory inside the module

16 Kbytes of I²C EEPROM (M24128-DFMN6TP) from STMicroelectronics

0.96-inch 128 x 64 OLED screen with SPI interface

Low-power Audio CODEC with PCM bus and I²C interface (MAX9867ETJ+ from Maxim)

Ultra-low-power 3D accelerometer and 3D magnetometer (LSM303AGR) from STMicroelectronics

Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics

260-1260 hPa absolute digital output barometer (LPS22HH) from STMicroelectronics

3 user LEDs

2 push-buttons (user and reset)

Board connectors:

  • SMA antenna connector

  • Two 50-pin 2.54 mm pitch headers

  • STMod+

  • micro-SIM card slot

  • 3.5 mm CTIA stereo headset jack including analog microphone input

  • USB Micro-B connectors for power, USARTs, USB device, and ST-LINK/V2-1

  • TAG10

  • mikroBUS expansion connectors

  • ESP‑01 expansion connector

  • Grove Seeed Studio™ breadboard, I²C, and UART expansion connectors

    • Flexible power-supply options: ST-LINK USB, User USB, UART USB, Power USB, or three AAA batteries

    On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port

    End-to-end connectivity applications

    Low‑power cellular network services from Truphone®

    Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE

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