Infineon NOR 256 MB CFI Flash Memory 64-Pin BGA, S29GL256P11FFIV20
- RS庫存編號:
- 193-8867
- 製造零件編號:
- S29GL256P11FFIV20
- 製造商:
- Infineon
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- RS庫存編號:
- 193-8867
- 製造零件編號:
- S29GL256P11FFIV20
- 製造商:
- Infineon
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Memory Size | 256MB | |
| Product Type | Flash Memory | |
| Interface Type | CFI | |
| Package Type | BGA | |
| Pin Count | 64 | |
| Organisation | 32M x 8 Bit | |
| Mount Type | Surface | |
| Cell Type | NOR | |
| Minimum Supply Voltage | 2.7V | |
| Maximum Supply Voltage | 3.6V | |
| Timing Type | Asynchronous | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Length | 13mm | |
| Width | 11 mm | |
| Height | 1mm | |
| Standards/Approvals | No | |
| Number of Words | 32M | |
| Series | S29GL256P | |
| Automotive Standard | No | |
| Supply Current | 110mA | |
| Number of Bits per Word | 8 | |
| Maximum Random Access Time | 110ns | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Memory Size 256MB | ||
Product Type Flash Memory | ||
Interface Type CFI | ||
Package Type BGA | ||
Pin Count 64 | ||
Organisation 32M x 8 Bit | ||
Mount Type Surface | ||
Cell Type NOR | ||
Minimum Supply Voltage 2.7V | ||
Maximum Supply Voltage 3.6V | ||
Timing Type Asynchronous | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Length 13mm | ||
Width 11 mm | ||
Height 1mm | ||
Standards/Approvals No | ||
Number of Words 32M | ||
Series S29GL256P | ||
Automotive Standard No | ||
Supply Current 110mA | ||
Number of Bits per Word 8 | ||
Maximum Random Access Time 110ns | ||
The Cypress S29GL01G/512/256/128P are Mirrorbit® Flash products fabricated on 90 nm process technology. These devices offer a fast page access time of 25 ns with a corresponding random access time as fast as 90 ns. They feature a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard programming algorithms. This makes these devices ideal for todays embedded applications that require higher density, better performance and lower power consumption.
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