可享批量折扣
查看批量定價選項小計（1 卷，共 2500 件）*
HK$30,127.50
訂單超過 HK$250.00 免費送貨
暫時缺貨
- 從 2027年1月04日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 2500 - 2500 | HK$12.051 | HK$30,127.50 |
| 5000 - 7500 | HK$11.81 | HK$29,525.00 |
| 10000 + | HK$11.574 | HK$28,935.00 |
* 參考價格
- RS庫存編號:
- 181-8247
- 製造零件編號:
- FM24CL04B-GTR
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Product Type | FRAM | |
| Memory Size | 4kB | |
| Organisation | 512M x 8 bit | |
| Data Bus Width | 8bit | |
| Maximum Random Access Time | 550ns | |
| Maximum Clock Frequency | 1MHz | |
| Mount Type | Surface | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Length | 4.97mm | |
| Standards/Approvals | No | |
| Width | 3.98mm | |
| Height | 1.38mm | |
| Maximum Operating Temperature | 85°C | |
| Minimum Operating Temperature | -40°C | |
| Automotive Standard | AEC-Q100 | |
| Maximum Supply Voltage | 3.65V | |
| Number of Words | 512M | |
| Number of Bits per Word | 8 | |
| Minimum Supply Voltage | 2.7V | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Product Type FRAM | ||
Memory Size 4kB | ||
Organisation 512M x 8 bit | ||
Data Bus Width 8bit | ||
Maximum Random Access Time 550ns | ||
Maximum Clock Frequency 1MHz | ||
Mount Type Surface | ||
Package Type SOIC | ||
Pin Count 8 | ||
Length 4.97mm | ||
Standards/Approvals No | ||
Width 3.98mm | ||
Height 1.38mm | ||
Maximum Operating Temperature 85°C | ||
Minimum Operating Temperature -40°C | ||
Automotive Standard AEC-Q100 | ||
Maximum Supply Voltage 3.65V | ||
Number of Words 512M | ||
Number of Bits per Word 8 | ||
Minimum Supply Voltage 2.7V | ||
Infineon FRAM, 4kB Memory Size, 3.65V Maximum Supply Voltage - FM24CL04B-GTR
This FRAM is a non-volatile memory device designed for low-power data storage in embedded and automotive systems. It operates within a typical single-supply range and provides byte-wide data access for firmware, calibration tables and logging tasks in space-constrained surface-mount designs. The component meets automotive stress requirements and is suitable for use across a broad industrial temperature range.
Features and Benefits:
• 8-bit data bus enabling simple byte-wise interfacing and firmware updates
• 1MHz clock supporting timely serial access for control systems
• 550ns maximum random access time reducing read latency in real-time tasks
• Operates from 2.7V to 3.65V providing compatibility with common supply rails
• AEC‑Q100 qualification permitting deployment in automotive electronic modules
• Surface-mount SOIC package allowing automated assembly on compact PCBs
• 1MHz clock supporting timely serial access for control systems
• 550ns maximum random access time reducing read latency in real-time tasks
• Operates from 2.7V to 3.65V providing compatibility with common supply rails
• AEC‑Q100 qualification permitting deployment in automotive electronic modules
• Surface-mount SOIC package allowing automated assembly on compact PCBs
Applications
• Suitable for automotive CAN node parameter storage
• Ideal for instrumentation requiring frequent non-volatile writes
• Used with microcontroller systems for calibration data retention
• Can be used for event logging in industrial control equipment
• Used for low-power battery-backed data buffering in sensors
• Ideal for instrumentation requiring frequent non-volatile writes
• Used with microcontroller systems for calibration data retention
• Can be used for event logging in industrial control equipment
• Used for low-power battery-backed data buffering in sensors
What voltage margins should designers expect when integrating this device?
The device functions across a minimum supply of 2.7V up to a maximum of 3.65V, allowing designers to select regulators and supervision thresholds that maintain reliable operation within that window.
How does the device perform under varying ambient temperatures?
It is specified to operate between -40°C and 85°C, ensuring predictable electrical behaviour for applications spanning industrial to automotive thermal environments.
What package considerations affect PCB layout for this component?
The package is a surface-mounted SOIC with a pin count of 8, so footprint clearance and solder fillet control should follow standard SOIC assembly practices to maintain mechanical and thermal integrity.
What is the organisation and capacity relevant to addressing?
Memory is organised as 512M words by 8 bits, providing a total count of addressable 8-bit locations appropriate for compact non-volatile storage needs.
相关链接
- Infineon 4 kB FRAM 8-Pin SOIC, FM24CL04B-GTR
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- Infineon 4 kB Serial-I2C FRAM 8-Pin SOIC-8, FM24CL04B-G
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