Infineon IR2214SSTRPBF MOSFET Gate Driver, 2 A 24-Pin 20V, SSOP

RS庫存編號:: 226-6161
製造零件編號:: IR2214SSTRPBF
製造商:: Infineon

Infineon IR2214SSTRPBF MOSFET Gate Driver, 2 A 24-Pin 20V, SSOP

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RS庫存編號:: 226-6161
製造零件編號:: IR2214SSTRPBF
製造商:: Infineon

規格

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產品詳細資訊

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選取全部	屬性	值
	品牌	Infineon
	Product Type	Gate Driver
	Output Current	2A
	Pin Count	24
	Fall Time	7ns
	Package Type	SSOP
	Number of Outputs	4
	Driver Type	MOSFET
	Rise Time	24ns
	Minimum Supply Voltage	11.5V
	Maximum Supply Voltage	20V
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	125°C
	Series	IR2214
	Height	2mm
	Length	8.5mm
	Standards/Approvals	No
	Width	5.6mm
	Mount Type	Surface
	Automotive Standard	No

	選取全部
	品牌 Infineon
	Product Type Gate Driver
	Output Current 2A
	Pin Count 24
	Fall Time 7ns
	Package Type SSOP
	Number of Outputs 4
	Driver Type MOSFET
	Rise Time 24ns
	Minimum Supply Voltage 11.5V
	Maximum Supply Voltage 20V
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 125°C
	Series IR2214
	Height 2mm
	Length 8.5mm
	Standards/Approvals No
	Width 5.6mm
	Mount Type Surface
	Automotive Standard No

Datasheet - IR2214SSTRPBF

Infineon IR2214 Series Gate Driver, 11.5V Minimum Supply Voltage, 2A Output Current - IR2214SSTRPBF

This gate driver is a surface-mount MOSFET driver IC designed to Interface low-voltage control logic with power switches in electronic systems. It operates from a low supply threshold and supports multi-output driving for Compact power stages, functioning across a wide ambient temperature range for demanding environments.

Features and Benefits:

• Operates from 11.5V allowing low-voltage system compatibility
• Supports up to 20V supply for increased gate-drive amplitude
• Four outputs enabling multi-channel switching control
• 2A output current for effective gate charge delivery
• Fast fall time of 7ns to reduce switching losses
• Rise time of 24ns aiding predictable switching behaviour

Applications

• Suitable for multi-phase power conversion stages
• Ideal for driving MOSFET banks in motor controllers
• Used with synchronous buck converters for gate control
• Can be used for Compact surface-mount power modules
• Used for temperature-stable switching in harsh environments

What package type should I plan for in PCB layout?

It is supplied in an SSOP package with 24 pins, so design pad and solder mask clearances to suit a 24-pin SSOP footprint.

What environmental limits must be considered for thermal design?

The device is rated to operate between -40°C and 125°C, so thermal management should account for maximum ambient and power dissipation at 125°C.

How many switching channels are available for parallel or independent control?

There are four independent outputs, permitting either parallel drive configurations or separate channel control.

What mounting method is required for assembly?

The component is intended for surface mounting, so standard SMD reflow processes are appropriate.