Infineon 1ED3123MC12HXUMA1 MOSFET Gate Driver 2, 13.5 A 8-Pin 17V, DSO

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RS庫存編號:
233-3474
製造零件編號:
1ED3123MC12HXUMA1
製造商:
Infineon
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品牌

Infineon

Product Type

Gate Driver

Output Current

13.5A

Pin Count

8

Package Type

DSO

Fall Time

30ns

Driver Type

MOSFET

Number of Outputs

2

Rise Time

30ns

Minimum Supply Voltage

3.1V

Number of Drivers

2

Maximum Supply Voltage

17V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Height

2.65mm

Length

7.5mm

Standards/Approvals

No

Width

6.4mm

Series

1ED3123MC12H

Mount Type

Surface

Automotive Standard

No

Infineon 1ED3123MC12H Series Gate Driver, 13.5A Output Current, 3.1V Minimum Supply Voltage - 1ED3123MC12HXUMA1


This gate driver is a dual-output MOSFET driver designed to control power transistors within low-voltage systems, operating across a wide supply range and suited to surface-mount assembly. It provides Rapid switching capability for two channels, supporting applications that require precise drive signals and stable operation over a broad temperature span.

Features and Benefits:


• Dual-channel output delivers independent drive for two MOSFETs
• 13.5A Peak output current enables high-current transistor switching
• Operates from 3.1V-17V supply for flexible system integration
• 30ns rise and fall times minimise switching losses and transition time
• Rated to 125°C for elevated temperature environments
• 8-pin DSO package supports Compact surface mounting

Applications


• Suitable for motor control inverter gate stages
• Ideal for synchronous buck converter gate control
• Used with half-bridge power stages in DC-DC converters
• Can be used for gate driving in LED driver circuits
• Suitable for high-current switching in industrial power modules

What supply range is required to drive the device?


The driver functions from a minimum of 3.1V up to a maximum of 17V enabling use in low-voltage and mid-voltage control rails.

How many outputs can be controlled and what is the current capability?


There are two independent outputs and each can source or sink Peak currents up to 13.5A for driving power transistors.

How does thermal performance affect placement on a board?


The component is specified to operate up to 125°C, so board layout should provide adequate copper area and thermal relief to manage dissipation at elevated junction temperatures.

Which package and mounting method does it use?


It is supplied in an 8-pin DSO package intended for surface-mount assembly to support Compact PCB designs.

What switching speed can be expected during transitions?


Rise and fall times are specified at 30ns, delivering fast transitions suitable for efficient high-frequency switching.

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