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    Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

    RS庫存編號:
    674-4756
    製造零件編號:
    ICK BGA 14x14x10
    製造商:
    Fischer Elektronik
    Fischer Elektronik
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    30 在3 工作日內發貨 (海外庫存)
    490 在4 工作日內發貨 (海外庫存)
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    單位

    已增加

    單價 個

    原價 HK$31.49

    您付款

    HK$21.55

    單位Per unit
    1 - 49HK$21.55
    50 - 99HK$20.95
    100 - 249HK$20.09
    250 +HK$19.54
    RS庫存編號:
    674-4756
    製造零件編號:
    ICK BGA 14x14x10
    製造商:
    Fischer Elektronik
    COO (Country of Origin):
    DE

    產品概覽和技術數據資料表


    法例與合規

    COO (Country of Origin):
    DE

    產品詳細資訊

    Fischer Elektronik ICK BGA Series Heatsink


    ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).


    Features and Benefits

    Black anodised surface.
    Heatsink dimensions match respective BGA-type.
    Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).


    BGA Heatsinks

    規格

    AttributeValue
    For Use WithBGA
    Length14mm
    Width14mm
    Height10mm
    Dimensions14 x 14 x 10mm
    Thermal Resistance27.4K/W
    MountingAdhesive Foil, Conductive Foil
    ColourBlack
    Package TypeBGA
    MaterialAluminium
    30 在3 工作日內發貨 (海外庫存)
    490 在4 工作日內發貨 (海外庫存)
    Add to Basket
    單位

    已增加

    單價 個

    原價 HK$31.49

    您付款

    HK$21.55

    單位Per unit
    1 - 49HK$21.55
    50 - 99HK$20.95
    100 - 249HK$20.09
    250 +HK$19.54