Infineon IHW30N120R5XKSA1, N-Channel IGBT Single Transistor IC, 60 A 1200 V, 3-Pin TO-247, Through Hole

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包裝方式:
RS庫存編號:
226-6078
製造零件編號:
IHW30N120R5XKSA1
製造商:
Infineon
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品牌

Infineon

Product Type

IGBT Single Transistor IC

Maximum Continuous Collector Current Ic

60A

Maximum Collector Emitter Voltage Vceo

1200V

Maximum Power Dissipation Pd

330W

Package Type

TO-247

Mount Type

Through Hole

Channel Type

N

Pin Count

3

Maximum Gate Emitter Voltage VGEO

25 V

Minimum Operating Temperature

-40°C

Maximum Collector Emitter Saturation Voltage VceSAT

1.55V

Maximum Operating Temperature

175°C

Length

42mm

Standards/Approvals

RoHS

Width

16.13mm

Series

Resonant Switching

Height

5.21mm

Automotive Standard

No

Infineon Resonant Switching Series IGBT Single Transistor IC, 1200V Max Collector Emitter Voltage, 60A Max Continuous Collector Current - IHW30N120R5XKSA1


This IGBT single-transistor IC is a three-pin, through-hole power transistor designed for high-voltage switching in resonant converter topologies. It operates across an extended temperature range and is suited to demanding industrial environments where high collector‑emitter voltage and substantial continuous current are required.

Features and Benefits:


• 1200 V collector‑emitter rating enables high-voltage switching capability
• 60 A continuous collector current supports heavy conduction loads
• 1.55 V VCE(sat) delivers low conduction losses during on‑state
• 330 W maximum power dissipation allows high-power handling
• 25 V gate‑emitter maximum protects gate against overdrive

Applications


• Suitable for resonant converter power stages in industrial systems
• Ideal for high-voltage power supplies requiring 1200 V devices
• Used for switch modules needing 60 A continuous capability
• Can be used in thermally stressed environments up to 175 °C
• Suitable for through‑hole assemblies and serviceable power boards

What gate protection limits should be observed?


Keep gate‑emitter excursions within ±25 V to prevent gate breakdown.

How does thermal range affect installation choices?


The device functions from −40 °C to 175 °C so heat‑sinking and airflow must match the upper temperature to maintain safe junction temperatures.

What mounting method is required for reliable operation?


Through‑hole mounting into a PCB or insulated heat‑sink mounting ensures mechanical stability and thermal conduction.

What package and pin count does it provide for board layout?


It is supplied in a TO‑247 package with three pins for standard power board footprints.

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