Infineon FP100R12N2T7BPSA2, Type N-Channel Common Emitter IGBT, 100 A 1200 V, 31-Pin Module, Panel
- RS庫存編號:
- 273-2919
- 製造零件編號:
- FP100R12N2T7BPSA2
- 製造商:
- Infineon
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 托盤，共 15 件）*
HK$11,708.805
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單位 | 每單位 | 每托盤* |
|---|---|---|
| 15 - 15 | HK$780.587 | HK$11,708.81 |
| 30 + | HK$715.533 | HK$10,733.00 |
* 參考價格
- RS庫存編號:
- 273-2919
- 製造零件編號:
- FP100R12N2T7BPSA2
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 100A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Number of Transistors | 7 | |
| Maximum Power Dissipation Pd | 20mW | |
| Configuration | Common Emitter | |
| Package Type | Module | |
| Mount Type | Panel | |
| Channel Type | Type N | |
| Pin Count | 31 | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.72V | |
| Maximum Operating Temperature | 175°C | |
| Length | 122mm | |
| Height | 20.5mm | |
| Standards/Approvals | IEC 60749, IEC 60747, IEC 60068 | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 100A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Number of Transistors 7 | ||
Maximum Power Dissipation Pd 20mW | ||
Configuration Common Emitter | ||
Package Type Module | ||
Mount Type Panel | ||
Channel Type Type N | ||
Pin Count 31 | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.72V | ||
Maximum Operating Temperature 175°C | ||
Length 122mm | ||
Height 20.5mm | ||
Standards/Approvals IEC 60749, IEC 60747, IEC 60068 | ||
Automotive Standard No | ||
The Infineon three phase PIM IGBT module with TRENCHSTOP IGBT7, emitter controlled 7 diode and NTC. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings.
High reliability and power density
Copper base plate for optimized heat spread
High power density
Solder contact technology