Broadcom 2.6 V Green LED 0402 Surface Chip LED HSMG-C280

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小計（4000 件, 每卷4000個）*

HK$3,716.00

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RS庫存編號:
178-1686
製造零件編號:
HSMG-C280
製造商:
Broadcom
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品牌

Broadcom

LED Colour

Green

Product Type

LED

Maximum Forward Current

25mA

Package Type

0402

Packaging

Tape & Reel

Mount Type

Surface

Forward Voltage

2.6V

Maximum Power Dissipation

60mW

Number of Pins

2

Viewing Angle

130 °

Lens Dimensions

1 x 0.5 x 0.4 mm

LED Luminous Flux

595 lm

LED Luminosity

15 mcd

Lens Shape

Rectangular

Standards/Approvals

RoHS

Dominant Wavelength

572nm

Series

Chip LED

Lens Finish

Clear

Lens Colour

Clear

Automotive Standard

No

Broadcom Chip LED Series LED, 572nm Dominant Wavelength, 25mA Maximum Forward Current - HSMG-C280


This LED is a surface-mount green light source designed for Compact electronic assemblies, providing visible indication and illumination functions in low-power systems. It operates within common small-package environments and is supplied in a tape-and-reel format suitable for automated placement.

Features and Benefits:


• Operates at 2.6V forward voltage for predictable drive requirements
• Supports up to 25mA forward current for brighter signalling
• Emits at 572nm dominant Wavelength for green output
• Offers 130° viewing angle for wide-area visibility
• Limits power dissipation to 60mW for low-power designs
• Complies with RoHS for restricted-substance conformity

Applications


• Used for indicator lamps on handheld instrumentation
• Suitable for status LEDs in Compact consumer electronics
• Ideal for signal arrays in low-power control panels
• Can be used for backlighting in small displays
• Used with automated pick-and-place due to tape-and-reel

What packaging format facilitates high-volume assembly?


It is supplied on tape-and-reel to match automated placement equipment.

What optical characteristic defines its perceived colour?


The dominant Wavelength is 572nm, corresponding to a green emission.

How does the package suit space-constrained boards?


The component uses a 0402 rectangular chip package and a clear lens for a minimal board footprint.

What operating limit should be observed to avoid thermal stress?


Maximum power dissipation is 60mW and should not be exceeded during operation.

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