Infineon ISC N-Channel MOSFET, 288 A, 60 V Enhancement, 8-Pin TDSON ISC011N06LM5ATMA1
- RS庫存編號:
- 233-4393
- 製造零件編號:
- ISC011N06LM5ATMA1
- 製造商:
- Infineon
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HK$230.80
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單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 5 | HK$46.16 | HK$230.80 |
| 10 - 95 | HK$45.24 | HK$226.20 |
| 100 - 245 | HK$44.30 | HK$221.50 |
| 250 - 495 | HK$43.46 | HK$217.30 |
| 500 + | HK$42.58 | HK$212.90 |
* 參考價格
- RS庫存編號:
- 233-4393
- 製造零件編號:
- ISC011N06LM5ATMA1
- 製造商:
- Infineon
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Channel Type | N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 288A | |
| Maximum Drain Source Voltage Vds | 60V | |
| Package Type | TDSON | |
| Series | ISC | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 1.15mΩ | |
| Channel Mode | Enhancement | |
| Typical Gate Charge Qg @ Vgs | 170nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 1.89kW | |
| Forward Voltage Vf | 1.1V | |
| Maximum Gate Source Voltage Vgs | 20V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Width | 1.2mm | |
| Height | 5.35mm | |
| Length | 6.1mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Channel Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 288A | ||
Maximum Drain Source Voltage Vds 60V | ||
Package Type TDSON | ||
Series ISC | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 1.15mΩ | ||
Channel Mode Enhancement | ||
Typical Gate Charge Qg @ Vgs 170nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 1.89kW | ||
Forward Voltage Vf 1.1V | ||
Maximum Gate Source Voltage Vgs 20V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Width 1.2mm | ||
Height 5.35mm | ||
Length 6.1mm | ||
Automotive Standard No | ||
Infineon ISC Series MOSFET, 60V Maximum Drain Source Voltage, 288A Maximum Continuous Drain Current - ISC011N06LM5ATMA1
This MOSFET is a power switching transistor designed for high-current, high-power applications in surface-mount assemblies. It operates across a wide thermal range and is suitable for demanding electronic systems that require an N-channel enhancement device with robust drain-to-source capability and gate voltage tolerance.
Features and Benefits:
• 60V drain withstand enables high-voltage switching capability
• 288A continuous current supports heavy-load conduction
• 1.15mΩ Rds(on) minimises conduction losses under load
• 1.89kW power dissipation permits high-power handling
• 170nC gate charge enables controlled switching dynamics
• 20V gate rating allows wide gate drive margin
• 288A continuous current supports heavy-load conduction
• 1.15mΩ Rds(on) minimises conduction losses under load
• 1.89kW power dissipation permits high-power handling
• 170nC gate charge enables controlled switching dynamics
• 20V gate rating allows wide gate drive margin
Applications
• Suitable for high current converters and power supplies
• Used with motor drives requiring strong conduction capacity
• Ideal for DC-DC stages in high-power systems
• Can be used for server and telecoms power modules
• Suitable for surface-mount power stages on Compact boards
• Used with motor drives requiring strong conduction capacity
• Ideal for DC-DC stages in high-power systems
• Can be used for server and telecoms power modules
• Suitable for surface-mount power stages on Compact boards
What temperature range can it reliably operate within?
It functions from -55°C up to 175°C, allowing use across extreme thermal environments.
What mounting style is recommended for board assembly?
It comes in a TDSON package intended for surface mounting on PCBs.
How many pins does the package present for connections?
The device uses an 8-pin configuration to accommodate gate, drain and source terminations.
What channel type and mode determine its conduction behaviour?
It is an N-channel device operating in enhancement mode for standard MOS switching.
What physical footprint should designers allow for on the PCB?
The package measures 6.1 x 5.35 x 1.2 mm and should be allotted appropriate solder landing area.
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