Infineon IPD N-Channel MOSFET, 180 A, 40 V N, 3-Pin TO-252 IPD80R280P7ATMA1

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HK$31,830.00

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RS庫存編號:
244-0945
製造零件編號:
IPD80R280P7ATMA1
製造商:
Infineon
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品牌

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

180A

Maximum Drain Source Voltage Vds

40V

Series

IPD

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

1.2mΩ

Channel Mode

N

Typical Gate Charge Qg @ Vgs

80nC

Forward Voltage Vf

900mV

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

81W

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Infineon IPD Series MOSFET, 40V Maximum Drain Source Voltage, 180A Maximum Continuous Drain Current - IPD80R280P7ATMA1


This MOSFET is a power N-channel transistor designed for high-current switching in surface-mounted applications. It operates across a broad temperature range for demanding environments and includes an intrinsic diode with defined forward voltage, making it suitable for automotive and industrial power stages.

Features and Benefits:


• 40V maximum drain-source voltage enabling mid-voltage system use
• 180A continuous drain current supporting heavy current loads
• 1.2mΩ low Rds(on) reducing conduction losses
• 81W power dissipation allowing sustained high-power operation
• 80nC gate charge for Rapid switching performance
• Vgs 20V maximum gate rating protecting gate-drive design

Applications


• Suitable for automotive power distribution modules
• Ideal for DC-DC converters in vehicles
• Used for motor-drive stages in electric systems
• Can be used for load switching in power management
• Appropriate for high-current SMD assemblies on boards

What temperature extremes can it withstand in operation?


It is specified to operate from -55°C to +150°C, providing a wide thermal range for harsh environments.

How does the intrinsic diode behave electrically?


The body diode exhibits a forward voltage of 0.9V which affects recirculating current and conduction loss during reverse conduction.

What packaging and mounting considerations apply for PCB design?


It is supplied in a TO-252 package intended for surface mounting, requiring appropriate solder-pad design and thermal management on the PCB.

Is it suitable for automotive-grade projects regarding qualification?


It meets the automotive AEC‑Q101 standard for suitability in automotive electronic applications.

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