Infineon BSD235C 2 Type N, Type P-Channel MOSFET, 950 mA, 20 V Enhancement, 6-Pin SOT-363 BSD235CH6327XTSA1

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RS庫存編號:
250-0522
製造零件編號:
BSD235CH6327XTSA1
製造商:
Infineon
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品牌

Infineon

Channel Type

Type N, Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

950mA

Maximum Drain Source Voltage Vds

20V

Package Type

SOT-363

Series

BSD235C

Mount Type

Surface Mount

Pin Count

6

Channel Mode

Enhancement

Maximum Power Dissipation Pd

0.5W

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

1.20V

Forward Voltage Vf

1.1V

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Number of Elements per Chip

2

Automotive Standard

AEC-Q101

Infineon BSD235C Series MOSFET, 20V Maximum Drain-Source Voltage, 0.95A Maximum Continuous Drain Current - BSD235CH6327XTSA1


This MOSFET is a dual enhancement‑mode transistor designed for compact, automotive‑grade applications. It integrates both N‑channel and P‑channel elements on a single chip within a 6‑pin SOT‑363 package, enabling small‑footprint switching and signal tasks. The device is specified to operate across a wide temperature span appropriate for demanding environments and conforms to environmental material restrictions.

Features and Benefits:


• 20V maximum drain source voltage enables low‑voltage switching capability
• 0.95A continuous drain current supports moderate current loads
• 1.2V gate‑source rating allows low‑voltage gate drive operation
• 0.5W power dissipation permits Compact thermal budgeting
• 150°C maximum operating temperature allows elevated ambient use

Applications


• Suitable for automotive load switching in restricted spaces
• Ideal for complementary push‑pull signal stages
• Used with low‑voltage control logic for gate driving
• Can be used for redundant dual‑element power management
• Used for Compact board designs requiring RoHS compliance

How many transistor elements are integrated on the chip?


It contains two elements, one N‑channel and one P‑channel.

What pin count and package should I plan for in PCB layout?


The device uses a 6‑pin SOT‑363 footprint for surface mounting.

What temperature extremes can it withstand during operation?


The permitted operating range extends from -55°C up to 150°C.

Is the device suitable where material restrictions apply?


It meets RoHS material requirements and is designed accordingly.

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