Infineon IRF8736 N-Channel MOSFET, 18 A, 30 V Enhancement, 8-Pin SO-8 IRF8736TRPBF

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包裝方式:
RS庫存編號:
258-8204
製造零件編號:
IRF8736TRPBF
製造商:
Infineon
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品牌

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

18A

Maximum Drain Source Voltage Vds

30V

Package Type

SO-8

Series

IRF8736

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

4.8mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

17nC

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

2.5W

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon IRF8736 Series MOSFET, 30V Maximum Drain-Source Voltage, 18A Maximum Continuous Drain Current - IRF8736TRPBF


This MOSFET is an N-channel enhancement device intended for low-voltage switching and power management in Compact surface-mount assemblies. It operates across a wide temperature range and is supplied in an SO-8 package for PCB mounting. The part conforms to RoHS directives and is designed for applications that require efficient conduction and controlled gate-drive energy.

Features and Benefits:


• 4.8mΩ Rds(on) for lower conduction losses and improved efficiency
• 17nC typical gate charge for predictable switching speed
• 30V Vds rating for low-voltage power-switching applications
• 18A continuous drain capability for moderate current loads
• 2.5W power dissipation for Compact thermal-budget designs

Applications


• Used for DC power switching in control modules
• Suitable for motor-driver stages with moderate current
• Ideal for high-efficiency power converters in restricted space
• Can be used for load switching on Compact assemblies
• Used with gate drivers requiring up to 20V gate voltage

What gate voltage limits should be observed?


The device must not be driven beyond a 20V gate-to-source differential to avoid gate overstress.

What operating temperatures can it tolerate?


It is specified to operate from -55°C up to 150°C for broad thermal environments.

How should its thermal dissipation be considered on a board?


With 2.5W maximum dissipation, layout should include copper area or thermal vias to manage junction temperature.

Is this component suitable for automotive-rated designs?


It is not classified as an automotive-standard device but complies with RoHS requirements.

What package and mounting style does it use?


The transistor is supplied in an SO-8 package intended for surface mounting on PCB assemblies.

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