Phoenix Contact DMCV Series Vertical Through Hole PCB Header, 38 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

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HK$7,608.00

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RS庫存編號:
489-158
製造零件編號:
1787373
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Product Type

PCB Header

Series

DMCV

Pitch

3.5mm

Current

8A

Number of Contacts

38

Housing Material

LCP

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON DFMC 1

Mount Type

Through Hole

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Tail Pin Length

2mm

Maximum Operating Temperature

100°C

Mating Pin Length

2mm

Standards/Approvals

cULus Recognised, VDE

Voltage

160V

COO (Country of Origin):
DE
The Phoenix Contact PCB header offers a reliable solution for connecting various electronic components, designed specifically for integration into the SMT soldering process. The compact form factor allows for multi-row arrangement, optimising space on the PCB for those critical applications. The robust construction ensures durability, with features tailored to meet the demands of modern electronic design. This header stands out for its black insulating material and is compliant with WEEE/RoHS standards, assuring users of its environmentally friendly credentials. With a nominal current rating of 8 A and a rated voltage of 160 V, this product combines efficiency with safety, making it a versatile addition to any electronic assembly.

Vertically oriented connections facilitate efficient multi-row PCB layout

Compact design caters to space-constrained applications

Sn-plated contacts ensure optimal conductivity and corrosion resistance

Solder pins designed for ease of mounting and enhanced reliability

Durable construction withstands harsh operating conditions

Moisture Sensitivity Level 1 aids in production planning

VDE and cULus approvals guarantee adherence to international safety standards

Designed for seamless integration into the prevailing production processes

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