Phoenix Contact MCDN Series Through Hole PCB Header, 6 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

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HK$2,442.10

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RS庫存編號:
492-767
製造零件編號:
1749340
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Product Type

PCB Header

Series

MCDN

Pitch

3.81mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

6

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON FMC 1

Contact Plating

Tin over Nickel

Contact Material

Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

3.81mm

Maximum Operating Temperature

100°C

Tail Pin Length

1.4mm

Contact Gender

Male

Mating Pin Length

1.4mm

Standards/Approvals

cULus Recognised (E60425-20110128), DIN EN 61760-1, IEC 60068-2-58, IEC 60068-2-70:1995-12, IEC 60068-2-82/JEDEC JESD 201, IEC 60112, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, IPC/JEDEC J-STD-020-C, ISO 6988:1985-02, UL 94 V0, VDE (40011723)

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact MCDN 1.5/3-G1-3.81 P14THR is a high-quality PCB header designed for effective integration into various electronic devices. This versatile component boasts a linear pinning layout and is specifically suitable for through hole reflow soldering, catering to a range of connection technologies. Its robust construction and thoughtful design enable higher contact density while allowing maximum flexibility in device design. The product ranges in applications requiring reliable electrical connections, making it essential for contemporary electronic assemblies. With a nominal current capacity of 8 A and a rated voltage of up to 160 V, this PCB header ensures dependable and safe operation across diverse environments, from offices to industrial settings. Moreover, the innovative design affords effortless assembly and durability, positioning it as an ideal choice for manufacturers seeking quality and performance.

Designed for seamless integration into the SMT soldering process

Allows for enhanced flexibility in device configurations and layout

Manufactured to meet stringent quality standards for reliability

Accommodates multiple connection technologies for diverse applications

Features a compact design that facilitates higher density connections

Ensures efficient heat management during the soldering process

Constructed with materials that comply with WEEE and RoHS regulations

Provides a moisture-sensitive level rating for safe handling

Supports a wide operating temperature range for versatile applications

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