Phoenix Contact IPC Series Wave Soldering Mount PCB Header, 5 Contact(s), 10.16 mm Pitch, 1 Row, Shrouded

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HK$10,313.43

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  • 2026年2月19日 發貨
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RS庫存編號:
492-892
製造零件編號:
1969645
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Series

IPC

Product Type

PCB Header

Pitch

10.16mm

Current

76A

Number of Contacts

5

Housing Material

Polyamide

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON PC 6 hybrid

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Silver

Row Pitch

10.16mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Tail Pin Length

4mm

Contact Gender

Female

Maximum Operating Temperature

105°C

Mating Pin Length

4mm

Standards/Approvals

cULus, EN 60695-10-2, EN 60695-2-12, EN 60695-2-13, IEC 60068-2-70, IEC 60512-1-1, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, IEC 61984, UL 94 V0, VDE

Voltage

1000 V

COO (Country of Origin):
PL
The Phoenix Contact IPC 16/5-GF-10.16 PCB header is engineered with precision to cater to the demands of contemporary electronic devices. It is designed to provide a secure and robust connector solution, making it an ideal choice for a range of applications. With its innovative inverted header design, this connector enhances safety by ensuring touch-proof connections and flexibility in device design. The green housing blends seamlessly into various environments while offering superior mechanical stability thanks to its screwable flange. Whether for device outputs or PCB-to-PCB connections, this connector excels in delivering reliability and optimum performance under a variety of conditions.

Innovative inverted design enhances safety for touch-proof connections

Screwable flange provides added mechanical stability

Flexible design accommodates multiple connection technologies

Linear pin layout ensures ease of integration with existing PCB designs

Built to withstand electrical and mechanical strain, ensuring longevity

ROHS compliant materials promote environmental responsibility

Seamless integration into various device configurations with a compact footprint

Packaged in cardboard, supporting sustainable practices

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