Phoenix Contact D32H Series Vertical Wave Soldering Mount PCB Header, 5 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded

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HK$1,429.50

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RS庫存編號:
517-155
製造零件編號:
1376547
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Product Type

PCB Header

Series

D32H

Current

8A

Pitch

5.08mm

Housing Material

Polybutylene Terephthalate

Number of Contacts

5

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

CONNEXIS

Mount Type

Wave Soldering Mount

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

5.08mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Tail Pin Length

3.8mm

Standards/Approvals

No

Mating Pin Length

3.8mm

Voltage

32V

COO (Country of Origin):
CN
The Phoenix Contact PCB header is designed to facilitate efficient connectivity in various electronic applications. The D32H 2.2/5-V-5.08-X model combines reliability with ease of use, making it a fantastic choice for those seeking robust performance. Crafted from high-quality materials, this header supports a nominal current of 8 A and a rated voltage of 320 V, ensuring seamless operation even in demanding environments. Its linear pin layout and snap-in locking mechanism enhance stability and reduce the risk of accidental disconnections. With a pitch of 5.08 mm, it accommodates diverse design needs, while its compact construction enables multi-row arrangements on PCBs for optimised space utilisation. This product exemplifies innovation and practicality, paving the way for effortless PCB replacements thanks to its user-friendly design.

Designed for wave soldering, enhancing assembly efficiency

Black housing offers a sleek, professional appearance

WEEE/RoHS compliant, promoting environmentally-friendly practices

Tested for durability to ensure longevity in challenging conditions

Supports modular assembly, simplifying maintenance and upgrades

Provides a reliable connection with minimal contact resistance

Suitable for high-density applications, maximising space efficiency

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