Molex 70543 Series Vertical PCB Header, 21 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

N

小計(1 管,共 50 件)*

HK$2,437.95

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RS庫存編號:
694-155
製造零件編號:
70543-0020
製造商:
Molex
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品牌

Molex

Product Type

Header

Series

70543

Current

3A

Pitch

2.54mm

Number of Contacts

21

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Plating

Gold

Contact Material

Brass and Phosphor Bronze

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex SL Header is a robust connection solution designed for efficient signal transmission in various electronic applications. Featuring a 2.54mm pitch and a single-row configuration with 21 circuits, this vertical PCB header offers 0.38μm gold selective plating for superior connectivity and durability. Its shrouded design enhances mating accuracy while minimising potential misalignment, making it Ideal for wire-to-board applications. Constructed from high-temperature thermoplastic, this Active component is engineered to withstand operational temperatures ranging from -40°C to +105°C, ensuring reliable performance under diverse conditions. Its compatibility with SL Single Row Crimp Housings ensures seamless integration into your existing systems.

Shrouded design improves mating accuracy and prevents misalignment

Vertical orientation allows for Compact assembly in space-restricted environments

Durable materials provide longevity and protect against wear during mating cycles

0.38μm gold plating offers excellent conductivity and corrosion resistance

Rated for a maximum voltage of 250V and current of 3.0A per contact

Suitable for through-hole termination, ensuring a secure connection to PCBs

Supports a wide operational temperature range for versatility in various applications

Locking mechanism ensures a reliable connection, reducing the risk of disconnection

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