Amphenol ICC 98464 Series Right Angle Through Hole PCB Header, 8 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 799-063
- 製造零件編號:
- 98464-G61-08ULF
- 製造商:
- Amphenol ICC
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小計（1 管，共 200 件）*
HK$1,903.16
訂單超過 HK$250.00 免費送貨
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- 從 2026年7月22日 發貨
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管 | 每管 | 每單位* |
|---|---|---|
| 1 + | HK$1,903.16 | HK$9.516 |
* 參考價格
- RS庫存編號:
- 799-063
- 製造零件編號:
- 98464-G61-08ULF
- 製造商:
- Amphenol ICC
規格
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法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 98464 | |
| Current | 2A | |
| Pitch | 2mm | |
| Number of Contacts | 8 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold or Tin over Nickel | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL94V-0 | |
| Voltage | 650V | |
| 選取全部 | ||
|---|---|---|
品牌 Amphenol ICC | ||
Product Type PCB Header | ||
Series 98464 | ||
Current 2A | ||
Pitch 2mm | ||
Number of Contacts 8 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Board-to-Board, Wire-to-Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold or Tin over Nickel | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals UL94V-0 | ||
Voltage 650V | ||
- COO (Country of Origin):
- FR
The Amphenol ICC Minitek header is designed for Pin-in-Paste processes, offering reliable solder-to-board connections while maintaining mechanical strength. Its innovative design facilitates seamless operation in surface mount technology assemblies.
Supports Pin-in-Paste technology for efficient soldering
Moulded from high-temperature thermoplastic for durability
Optimised pin design reduces solder paste displacement
Compatible with IR reflow soldering processes
相关链接
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