Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

RS庫存編號:: 233-2955
製造零件編號:: 43045-0400
製造商:: Molex

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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HK$40.10

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單位	每單位	每包*
5 - 120	HK$8.02	HK$40.10
125 - 495	HK$7.88	HK$39.40
500 - 2495	HK$7.68	HK$38.40
2500 - 12495	HK$7.50	HK$37.50
12500 +	HK$6.16	HK$30.80

* 參考價格

RS庫存編號:: 233-2955
製造零件編號:: 43045-0400
製造商:: Molex

規格

產品概覽和技術數據資料表

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產品詳細資訊

透過選取一個或多個屬性來查找類似產品。

選取全部	屬性	值
	品牌	Molex
	Product Type	PCB Header
	Series	Micro-Fit 3.0
	Pitch	3mm
	Current	5A
	Housing Material	Thermoplastic
	Number of Contacts	4
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Connector System	Wire-to-Board
	Mount Type	Through Hole
	Contact Plating	Tin
	Contact Material	Brass
	Minimum Operating Temperature	-40°C
	Row Pitch	3mm
	Termination Type	Solder
	Contact Gender	Male
	Maximum Operating Temperature	105°C
	Mating Pin Length	3mm
	Standards/Approvals	No
	Voltage	250 V
	Distrelec Product Id	304-40-666

	選取全部
	品牌 Molex
	Product Type PCB Header
	Series Micro-Fit 3.0
	Pitch 3mm
	Current 5A
	Housing Material Thermoplastic
	Number of Contacts 4
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Connector System Wire-to-Board
	Mount Type Through Hole
	Contact Plating Tin
	Contact Material Brass
	Minimum Operating Temperature -40°C
	Row Pitch 3mm
	Termination Type Solder
	Contact Gender Male
	Maximum Operating Temperature 105°C
	Mating Pin Length 3mm
	Standards/Approvals No
	Voltage 250 V
	Distrelec Product Id 304-40-666

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Molex Right Angle PCB Header, 4 Way, 2 Rows - Micro-Fit 3.0 Series - 43045-0400

This header from Molex's Micro-Fit 3.0 series has a right-angled orientation to save space on your PCB (printed circuit board) and reduce strain on cables. It's a reliable and compact 4-way header with a 3.0mm pitch and is used in low-range to mid-range power distribution. The housing is made from a high-temperature liquid crystal polymer that's able to handle the high temperatures (up to +265°C) that occur during the infra-red reflow soldering process. The contacts are fully isolated inside the housing to reduce arcing.

Features & Benefits

• Locking ramps on the housing offer positive latching to prevent accidental disconnection

• Tin-plated contacts resist corrosion to ensure excellent conductivity and reliable data transfer

• Plastic peg PCB locks make a secure connection to the PCB

• Through-hole mounting and solder termination make a strong connection with the board

Applications

• Data communications

• Solar power installations

• Gaming terminals

What's the Molex Micro-Fit system?

Molex's Micro-Fit system is a compact and versatile series of connectors available in multiple circuit sizes and cable lengths. These components are used for board-to-board, wire-to-board and wire-to-wire configurations.

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits

• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals