Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 60-Contact, 2 Row, 800 μm Pitch Solder
- RS庫存編號:
- 162-2064
- 製造零件編號:
- 61082-061400LF
- 製造商:
- Amphenol Communications Solutions
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計（1 管，共 16 件）*
HK$348.21
訂單超過 HK$250.00 免費送貨
最後的 RS 庫存
- 最終 336 個，準備發貨
單位 | 每單位 | 每管* |
|---|---|---|
| 16 - 16 | HK$21.763 | HK$348.21 |
| 32 - 48 | HK$21.213 | HK$339.41 |
| 64 + | HK$20.894 | HK$334.30 |
* 參考價格
- RS庫存編號:
- 162-2064
- 製造零件編號:
- 61082-061400LF
- 製造商:
- Amphenol Communications Solutions
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Amphenol Communications Solutions | |
| Product Type | PCB Socket | |
| Number of Contacts | 60 | |
| Sub Type | Board-to-Board | |
| Number of Rows | 2 | |
| Current | 500mA | |
| Pitch | 800μm | |
| Termination Type | Solder | |
| Housing Material | Glass Reinforced Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 20mm | |
| Connector System | Board-to-Board | |
| Voltage | 100V | |
| Series | BergStak | |
| Minimum Operating Temperature | -65°C | |
| Contact Plating | Gold | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Amphenol Communications Solutions | ||
Product Type PCB Socket | ||
Number of Contacts 60 | ||
Sub Type Board-to-Board | ||
Number of Rows 2 | ||
Current 500mA | ||
Pitch 800μm | ||
Termination Type Solder | ||
Housing Material Glass Reinforced Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 20mm | ||
Connector System Board-to-Board | ||
Voltage 100V | ||
Series BergStak | ||
Minimum Operating Temperature -65°C | ||
Contact Plating Gold | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- SG
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.
Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’
The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.
相关链接
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket 2 Row, 0.8 mm Pitch Solder
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket 2 Row, 0.8 mm Pitch Solder
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket 2 Row, 0.8 mm Pitch Solder
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket 2 Row, 0.8 mm Pitch Solder
- Amphenol Communications Solutions BergStak Series Straight PCB PCB Socket 3 Row, 0.8 mm Pitch Solder
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Header 0.8 mm Pitch
- Amphenol Communications Solutions BergStak Series Straight Surface PCB Header 0.8 mm Pitch
- Amphenol Communications Solutions Bergstak Lite Series Straight PCB PCB Header 0.8 mm Pitch