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選取全部	屬性	值
	品牌	MG Chemicals
	Product Material	Epoxy
	Package Type	Dual Cartridge
	Package Size	25 mL
	Special Properties	Chemical Resistance, Harsh Resistance, Salt Water Resistance
	Cure Time	24 h @ +25°C
	Hardness	80 Shore D
	Thermal Conductivity	0.27W/mK
	Maximum Operating Temperature	+150°C
	Minimum Operating Temperature	-40°C
	Dielectric Strength	15.8 kV/mm, 400 V/mil
	Viscosity Measurement	2300 (Part B) cP, 5900 (Part A) cP
	Odour	Ammoniacal, Sulphurous
	Volume Resistivity	1.4 x 10^13Ω cm
	Physical Form	Liquid
	Operating Temperature Range	-40 → +150 °C

	選取全部
	品牌 MG Chemicals
	Product Material Epoxy
	Package Type Dual Cartridge
	Package Size 25 mL
	Special Properties Chemical Resistance, Harsh Resistance, Salt Water Resistance
	Cure Time 24 h @ +25°C
	Hardness 80 Shore D
	Thermal Conductivity 0.27W/mK
	Maximum Operating Temperature +150°C
	Minimum Operating Temperature -40°C
	Dielectric Strength 15.8 kV/mm, 400 V/mil
	Viscosity Measurement 2300 (Part B) cP, 5900 (Part A) cP
	Odour Ammoniacal, Sulphurous
	Volume Resistivity 1.4 x 10^13Ω cm
	Physical Form Liquid
	Operating Temperature Range -40 → +150 °C

COO (Country of Origin):: CA

The 832HD 1:1 Epoxy Potting and Encapsulating Compound is a two-part, economical, flowable, electronic-grade epoxy that provides excellent physical, chemical, and electrical protection. It is very easy to use due its 1:1 mix ratio and because it is room temperature curable. In its cured state, it protects electronic assemblies against corrosion, static discharges, shocks, vibrations, and mechanical impacts.

Non-corrosive
Flowable and high durability
Very high tensile and compressive strength
Easy mix ratio 1A:1B by volume
Free of solvents
1static mixer included

MG Chemicals 832HD-25ML Epoxy Potting Compound 25 mL

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