STMicroelectronics RF Transceiver, 6-Pin Bumpless CSP
- RS庫存編號:
- 192-4203P
- 製造零件編號:
- MLPF-WB55-01E3
- 製造商:
- STMicroelectronics
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額外添加2500件可節省1%
查看批量定價選項小計 1250 件 (以卷裝提供)*
HK$2,775.00
訂單超過 HK$250.00 免費送貨
暫時缺貨
- 從 2027年3月02日 發貨
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單位 | 每單位 | 節省 |
|---|---|---|
| 1250 - 2475 | HK$2.22 | - |
| 2500 + | HK$2.184 | 1% |
* 參考價格
- RS庫存編號:
- 192-4203P
- 製造零件編號:
- MLPF-WB55-01E3
- 製造商:
- STMicroelectronics
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | STMicroelectronics | |
| Technology | IPD on Non-Conductive Glass Substrate | |
| Product Type | RF Transceiver | |
| Sub Type | RF Transceiver | |
| Package Type | Bumpless CSP | |
| Pin Count | 6 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 2500MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Series | MLPF-WB55 | |
| Length | 1.63mm | |
| Width | 1.6mm | |
| Standards/Approvals | ECOPACK2 | |
| Automotive Standard | No | |
| Number of Operating Bands | 1 | |
| 選取全部 | ||
|---|---|---|
品牌 STMicroelectronics | ||
Technology IPD on Non-Conductive Glass Substrate | ||
Product Type RF Transceiver | ||
Sub Type RF Transceiver | ||
Package Type Bumpless CSP | ||
Pin Count 6 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 2500MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Series MLPF-WB55 | ||
Length 1.63mm | ||
Width 1.6mm | ||
Standards/Approvals ECOPACK2 | ||
Automotive Standard No | ||
Number of Operating Bands 1 | ||
- COO (Country of Origin):
- CN
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Integrated impedance matching to STM32WB55Cx and STM32WB55Rx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
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