Infineon SRAM, CY62148ELL-55SXI- 4 MB

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包裝方式:
RS庫存編號:
124-2941
製造零件編號:
CY62148ELL-55SXI
製造商:
Infineon
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品牌

Infineon

Memory Size

4MB

Product Type

SRAM

Organisation

512 k x 8 Bit

Number of Words

512K

Number of Bits per Word

8

Maximum Random Access Time

45ns

Address Bus Width

8bit

Maximum Clock Frequency

1MHz

Timing Type

Asynchronous

Minimum Supply Voltage

4.5V

Mount Type

Surface

Maximum Supply Voltage

5.5V

Package Type

SOIC

Minimum Operating Temperature

-40°C

Pin Count

32

Maximum Operating Temperature

85°C

Series

CY62148E

Standards/Approvals

No

Height

2.81mm

Length

20.75mm

Width

11.43mm

Supply Current

20mA

Automotive Standard

No

Infineon CY62148E Series SRAM, 4MB Memory Size, 1MHz Maximum Clock Frequency - CY62148ELL-55SXI


This SRAM is a static memory device designed for short-term data storage in electronic systems. It operates within typical embedded environments where quick read/write access and simple timing are required. The device is supplied as a surface-mount SOIC package and is intended for designs requiring non-volatile-free volatile memory with an 8-bit data path and 512K words of capacity.

Features and Benefits:


• Asynchronous 45 ns access time delivers fast random reads and writes
• Supports up to 1 MHz clock frequency for responsive memory cycles
• 5.5V maximum supply allows compatibility with higher-voltage systems
• 4.5V minimum supply enables reliable low-voltage operation
• 20 mA supply current provides predictable power budgeting
• Operating range -40 to 85 °C suits deployment across industrial temperatures

Applications


• Suitable for buffering in microcontroller-based systems
• Ideal for temporary data logging in industrial equipment
• Used with control units requiring 8-bit parallel data transfer
• Can be used for firmware shadow RAM in legacy electronics
• Suitable for surface-mount assemblies where SOIC is required

How is addressing organised for system integration?


The memory is arranged as 512K words of 8 bits, accessed through an 8-bit address bus width allowing straightforward byte-oriented addressing.

What package considerations affect PCB layout?


The device is supplied in a 32-pin SOIC surface-mount package, which informs footprint, solder paste mask and thermal considerations during PCB design.

How does the device behave thermally during operation?


It is specified for use from -40 °C to 85 °C, so thermal design should account for ambient extremes and power dissipation driven by its 20 mA supply current.

What pin-count and signalling style should I expect?


The component uses a 32-pin configuration and operates with asynchronous timing, which simplifies timing constraints compared with synchronous memory.

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