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    Heatsink, Clip, 29 x 29 x 28mm, Clip

    RS庫存編號:
    489-6079
    製造零件編號:
    MBH29001-28W/2.6
    製造商:
    Malico

    此圖片僅供參考,請參閲產品詳細資訊及規格

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    124 現貨庫存,可於3工作日發貨。
    Add to Basket
    單位

    已增加

    單價 個

    HK$57.45

    單位Per unit
    1 - 99HK$57.45
    100 - 249HK$55.15
    250 - 499HK$52.85
    500 +HK$51.71
    RS庫存編號:
    489-6079
    製造零件編號:
    MBH29001-28W/2.6
    製造商:
    Malico

    法例與合規

    COO (Country of Origin):
    TW

    產品詳細資訊

    BGA Chipset Heat Sinks


    High-performance precision-forged clip-attachment heatsinks for BGA chipsets.

    AL6063 grade aluminium at 201 W/m K thermal conductivity
    Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
    Attachment by plastic clip
    Excellent performance for both natural convection and low to medium airflow levels with low pressure drop


    BGA Heatsinks

    規格

    AttributeValue
    For Use WithClip
    Length29mm
    Width29mm
    Height28mm
    Dimensions29 x 29 x 28mm
    MountingClip
    ColourBlack
    124 現貨庫存,可於3工作日發貨。
    Add to Basket
    單位

    已增加

    單價 個

    HK$57.45

    單位Per unit
    1 - 99HK$57.45
    100 - 249HK$55.15
    250 - 499HK$52.85
    500 +HK$51.71