Microchip, 8 bit PIC, PIC XLP 16F Microcontroller, 32 MHz, 28kB FLASH, 28-Pin DIP
- RS庫存編號:
- 236-8894
- 製造零件編號:
- PIC16F15356-I/SP
- 製造商:
- Microchip
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
小計(1 管,共 15 件)*
HK$236.505
庫存資訊目前無法查詢
單位 | 每單位 | 每管* |
|---|---|---|
| 15 - 15 | HK$15.767 | HK$236.51 |
| 30 - 90 | HK$15.453 | HK$231.80 |
| 105 + | HK$15.147 | HK$227.21 |
* 參考價格
- RS庫存編號:
- 236-8894
- 製造零件編號:
- PIC16F15356-I/SP
- 製造商:
- Microchip
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Microchip | |
| Series | PIC XLP 16F | |
| Product Type | Microcontroller | |
| Package Type | DIP | |
| Mount Type | Surface | |
| Pin Count | 28 | |
| Device Core | PIC | |
| Data Bus Width | 8bit | |
| Program Memory Size | 28kB | |
| Maximum Clock Frequency | 32MHz | |
| RAM Size | 2kB | |
| Maximum Supply Voltage | 5.5V | |
| Minimum Operating Temperature | -40°C | |
| Number of Programmable I/Os | 25 | |
| DACs | 1 x 5 Bit | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS3 | |
| Width | 7.62 mm | |
| Minimum Supply Voltage | 2.3V | |
| Automotive Standard | No | |
| Number of Timers | 2 | |
| Program Memory Type | FLASH | |
| Instruction Set Architecture | RISC | |
| ADCs | 24 x 10 Bit | |
| 選取全部 | ||
|---|---|---|
品牌 Microchip | ||
Series PIC XLP 16F | ||
Product Type Microcontroller | ||
Package Type DIP | ||
Mount Type Surface | ||
Pin Count 28 | ||
Device Core PIC | ||
Data Bus Width 8bit | ||
Program Memory Size 28kB | ||
Maximum Clock Frequency 32MHz | ||
RAM Size 2kB | ||
Maximum Supply Voltage 5.5V | ||
Minimum Operating Temperature -40°C | ||
Number of Programmable I/Os 25 | ||
DACs 1 x 5 Bit | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS3 | ||
Width 7.62 mm | ||
Minimum Supply Voltage 2.3V | ||
Automotive Standard No | ||
Number of Timers 2 | ||
Program Memory Type FLASH | ||
Instruction Set Architecture RISC | ||
ADCs 24 x 10 Bit | ||
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
C Compiler optimized RISC architecture
DC – 32 MHz clock input
125 ns minimum instruction cycle
Interrupt capability
16-Level deep hardware stack
8 Bit timer2 with hardware limit timer (HLT)
16-bit Timer0/1
Low current power on reset (POR)
Configurable power up timer (PWRTE)
Brown out reset (BOR)
low power BOR (LPBOR) option
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